EMCP221 Flip Shrapnel To SD Test Seat EMCP Programmer Burn Data Reading Socket

1. Type: test block
2. Working frequency: low frequency
3. Application: integrated circuit IC
4. Interface type: shrapnel

testing method:
1. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
2. Plug the USB cable into the USB port of the computer, turn on the power switch of the socket, and select the corresponding test program

Features:
1. The standard SD interface mode is adopted, and the corresponding operations such as testing or burning can be realized by connecting the card reader to the computer or connecting the programmer SD interface
2. Compatible with ball and no ball test, the IC limit frame is formed by a mold, and different size limit frames can be selected according to the IC for replacement, so that different sizes of ICs can be universal
3. Support hot plugging, support for testing through SD interface or through connection with the board on the board corresponding to the PIN
4. The PCB adopts a 4-layer circuit structure to reduce the instability of the product due to signal interference during use. The gold fingers are plated with thick gold to ensure durability and contact.
5. The structure adopts injection molding, the positioning is accurate, the IC is convenient to pick and place, and the work efficiency is higher
6. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head shape is imitated by the probe design, and the latter is hardened and thickened with gold plating to ensure product stability and durability;
7. The connection module adopts an overall structure to reduce repeated positioning problems and ensure that its contact points are accurately aligned with the IC PAD. The pass rate is high. 8. The through-hole welding structure ensures good contact. SOCKET and PCBA use positioning holes for precise positioning and easy replacement ï¼›
9. It adopts a flip-type structure, which is more convenient for manual testing, and the operation is convenient and simple;
10. Adopting mold integral molding and spring self-adaptive structure to ensure that ICs of different thicknesses do not need any adjustment to ensure good contact. Test ICs have wide versatility (the thickness range of 0.6-2.0MM can be tested)