EMCP162 186 Downward Pressure Shrapnel To SD Interface Test Socket Burner Programmer

1. Type: test block
2. Interface type: SD
3. Application: integrated circuit IC
4. Test method:
A. Select the limit frame that matches the IC, and place the IC flat in the SOCKET according to the direction
B. Insert the free SD interface according to the direction, connect to the computer or programmer for corresponding testing and burning

Features:
1. The standard SD interface mode is adopted, and the corresponding operations such as testing or burning can be realized by connecting the card reader to the computer or connecting the programmer SD interface
2. Compatible with ball and no ball test, the IC limit frame is formed by a mold, and different size limit frames can be selected according to the IC for replacement, so that different sizes of ICs can be universal
3. Support hot plugging, support for testing through SD interface or through connection with the board on the board corresponding to the PIN
4. The PCB adopts a 4-layer circuit structure to reduce the instability of the product due to signal interference during use. The gold fingers are plated with thick gold to ensure durability and contact.
5. Compatible with both 162-FBGA and 186-FBGA
6. The shrapnel is made of imported beryllium copper by high-precision die stamping, and the head-shaped probe is designed to be hardened and thickened in the later stage to ensure product stability and durability.
7. The connection module adopts an overall structure to reduce the problem of repeated positioning, and ensure that its contact point is accurately aligned with the IC PAD, and the pass rate of one test is high.
8. Adopt through-hole welding structure to ensure good contact, SOCKET and PCBA use positioning holes for precise positioning and easy replacement
9. Adopting flip structure, it is more convenient for manual testing, and the operation is convenient and simple
10. Adopting the integral moulding and spring self-adaptive structure to ensure that ICs of different thicknesses do not need any adjustments to ensure good contact. Test ICs are versatile (the thickness range of 0.6-2.0MM can be tested)
11. The structure adopts injection molding, precise positioning, convenient access to IC, and higher work efficiency

Repair and maintenance:
1. Use an air gun or anti-static brush to remove impurities in the SOCKET seat to make it contact well;
2. Clean the SOCKET with absolute alcohol to clean the attached impurities on the top of the shrapnel and make it contact well;
3. If you find that the shrapnel inside the SOCKET is burned or broken, please purchase the corresponding SOCKET to replace it;
4. The plug in the interface is not detected or cannot be tested, check whether the shrapnel in SOCKET is burned out (if any, please press C to deal with) or there are individual PINs (total 17PIN) that do not pop up naturally (if any, please press C to deal with), check gold Whether the finger is dirty, please wipe the golden finger with an eraser and try again to check whether the card reader or programmer is normal;
5. It is strictly forbidden to soak and clean with organic solvents such as thinner water and board washing water to avoid damage to the internal structure of SOCKET;
6. When not in use for a long time, please seal it with an anti-static bag to prevent dust from falling in and affect the product test performance.