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0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.65/0.75mm BGA Lead-Free Tin Solder Ball 25KDescription:100% brand new and high qualityFeature: We have all size of solder ball, including lead-free solder ball 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.65/0.75mm.Solder (Tin) paste is the best choice of reballing IC. It is used instead of the pin in the IC component package structure. Widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and assembly of multiple integrated circuits in the electronics industry.Comes with the storage box, it can well storage these reballing balls.BGA Reballing Balls with storage box only, other accessories demo in the picture is not included!Specifications:Item Type: BGA Reballing BallsSize: diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.6/0.65/0.75mmColor: As shownQuantity: 2.5w PCS per bottleBalls Alloy: Sn96.5/Ag3Quantity: 1 Set(11 Bottle)Note:Transition: 1cm=10mm=0.39inchPlease allow 0-1cm error due to manual measurement.
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